분류 분말/세라믹기술
기술명 Thermally Conductive AlN Thick Films for High Power Electronic Packages
연구자 Byung-Dong Hahn
특허출원번호 KR10-1735822
개요 Increasingly lighter, thinner, shorter and smaller electronic parts lead to higher heat density that,
in turn, lower elements' functionality, shorten their lives and undermine their reliability.
  --> The key to addressing these problems is to ensure that heat is properly released from electronic packages.

Existing high power electronic packages use highly thermal conductive ceramic substrates.
  --> This necessitates use of low thermal conductive, thermal interface material to connect the
            substrate and heat sink.

This technology pertains to applying thermally conductive AlN thick films to the surface of metal heat sink
  --> No thermal interface material required; thin package; less thermal resistance
첨부파일   059_Thermally_Conductive_AlN_Thick_Films_for_High_Power_Electronic_Packages.jpg (626.9K) [16] DATE : 2018-02-09 16:23:21