| 분류 | 표면기술 |
|---|---|
| 기술명 | Micro Electroplating Technology |
| 연구자 | Yongsoo Jeong , Ju-Yeol Lee |
| 특허출원번호 | |
| 개요 | Electric, electronic and semiconductor parts are getting more integrated, thinner and more
multi-functional in terms of metal pattern size, pitch and array. This technology pertains to fabricating a highly functional plating solution and low cost probe pins. |
| 첨부파일 |  071_Micro_Electroplating_Technology.jpg (620.6K) [16] DATE : 2018-02-09 16:46:21 |
![071_Micro_Electroplating_Technology.jpg (620.6K) [16] DATE : 2018-02-09 16:46:21](javascript:file_download('./download.php?bo_table=tlo_03_01&wr_id=398&no=0&page=13', '071_Micro_Electroplating_Technology.jpg');){kind=link}
