개요 |
Forming metal electrodes on an Si3N4 insulating substrate via electroless plating
Improving fitness between the substrate and the metal electrode through surface etching
and surface treatment
1) Surface etching: Dry etching is applied to extend the substrate's surface area and then
electroless plating is applied to from an electrode layer.
2) Surface treatment: Silane base is used to form chemical bonding between the substrate
and the metal layer for higher fitness.
Improving fitness by using Pd-TiO2 layer and creating Sn free electroless plating core
|