개요 |
Increasingly lighter, thinner, shorter and smaller electronic parts lead to higher heat density that,
in turn, lower elements' functionality, shorten their lives and undermine their reliability.
--> The key to addressing these problems is to ensure that heat is properly released from electronic packages.
Existing high power electronic packages use highly thermal conductive ceramic substrates.
--> This necessitates use of low thermal conductive, thermal interface material to connect the
substrate and heat sink.
This technology pertains to applying thermally conductive AlN thick films to the surface of metal heat sink
--> No thermal interface material required; thin package; less thermal resistance
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