분류 금속재료
기술명 Superplastic Forming and Diffusion Bonding for Aerospace Parts
연구자 Yong-nam Kwon
특허출원번호 KR 10-1243033
개요 This technology can be used to reduce the weight of aerospace parts.
It allows hard-to-fabricate materials such as Ti, Ni, Al alloy to be formed freely like plastic
so that complicated geometry can be fabricated through a simplified process.

1. Allows aerospace parts to be bigger and integrated
2. Reduction in weight of parts through more efficient use of materials (by 15 to 50 percent)
3. Cost reduction of 20 to 60 percent
4. Applicable to private sectors as well as military purposes including aircraft, rolling stock,
    automobiles
첨부파일   031_Superplastic_Forming_and_Diffusion_Bonding_for_Aerospace_Parts.jpg (579.1K) [17] DATE : 2018-02-08 15:52:24