| 분류 | 표면기술 |
|---|---|
| 기술명 | Advanced & Precise Electroplating Using Simulation |
| 연구자 | Kyu-Hwan Lee |
| 특허출원번호 | SW C-2012-008721 |
| 개요 | Non-uniform current density distribution during electroplating often causes inconsistency in the thickness
of plating, affecting the exterior, quality or performance of the product. Methods to ensure consistent thickness include electrode placement, shield, counter cathode and counter anode. These are hard to optimize as they depend on trial and error. Simulation of electroplating can reduce loss of time, money and material resulting from such trial and error and help achieve the highest quality and find optimal plating conditions. This technology can be applied to simulation of electro-chemical processes including flow analysis, etching analysis and corrosion analysis. |
| 첨부파일 |  073_Advanced_&_Precise_Electroplating_Using_Simulation.jpg (703.6K) [14] DATE : 2018-02-09 16:50:36 |
![073_Advanced_&_Precise_Electroplating_Using_Simulation.jpg (703.6K) [14] DATE : 2018-02-09 16:50:36](javascript:file_download('./download.php?bo_table=tlo_03_01&wr_id=400&no=0&page=13', '073_Advanced_%26_Precise_Electroplating_Using_Simulation.jpg');){kind=link}
