분류 표면기술
기술명 Formation of Electrode on Insulating Substrate via Electrochemical Process
연구자 Jae-hong Lim
특허출원번호 KR10-2017-0093253
개요 Forming metal electrodes on an Si3N4 insulating substrate via electroless plating

Improving fitness between the substrate and the metal electrode through surface etching
and surface treatment
        1) Surface etching: Dry etching is applied to extend the substrate's surface area and then 
          electroless plating is applied to from an electrode layer.
        2) Surface treatment: Silane base is used to form chemical bonding between the substrate
            and the metal layer for higher fitness.
            Improving fitness by using Pd-TiO2 layer and creating Sn free electroless plating core
첨부파일   077_Formation_of_Electrode_on_Insulating_Substrate_via_Electrochemical_Process.jpg (576.1K) [15] DATE : 2018-02-09 16:59:01